MicroStep Joins the SPICE Transformation and Innovation Consortium

MicroStep is proud to join SPICE (Smart Data Pipelines for the Cognitive Compute Continuum), a leading European innovation initiative that brings together prominent technology partners to advance intelligent data processing across cloud, edge, and IIoT infrastructures.

SPICE marks a significant advancement in processing large-scale data for industrial applications. Coordinated by InterWay, the consortium was selected as a top-rated project under EU’s transformation and innovation program. Its mission is to pave the way for future-ready, data-driven industrial solutions.

As part of the initiative’s Unified Cloud pilot, MicroStep is developing a predictive maintenance and process optimization platform tailored for advanced laser cutting centres.

MicroStep’s involvement in SPICE underscores the company’s long-standing commitment to innovation and its ability to merge high-end technologies with real-world industrial needs. As a global leader in CNC cutting technologies and intelligent manufacturing systems, MicroStep continues to deliver cutting-edge solutions that enhance reliability, efficiency, and sustainability in modern production environments.

The SPICE initiative was launched under the Transformation and Innovation Call (TIK), funded by the Slovak Recovery and Resilience Plan and managed by the VAIA agency of the Slovak Government Office.